Redmi 13 BUND576 Wire material: pure tinned copper

Wire material: pure tinned copper

providing a pleasant and efficient experience wherever you go

Digital Storage Capacity 8 GB Hard Disk Interface NVMe Connectivity Technology USB Brand Western Digital Hard Disk Form Factor 2280 Inches Compatible Devices PC Color Black Specific Uses For Product Storage Read Speed 2050 Megabytes Per Second Cache Size 254

panorama Video 1080p@30fps     SELFIE CAMERA Single 5 MP

Redmi 13 BUND576 Wire material: pure tinned copperFull Specs: Launch Announced 2024, June 03 Status Available. Released 2024, June 03 Body Dimensions 168. 6 x 76. 3 x 8. 3 mm (6. 64 x 3. 00 x 0. 33 in) Weight 205 g (7. 23 oz) Build Glass front, plastic frame, glass back SIM Hybrid Dual SIM (Nano SIM, dual stand by) IP53, dust and splash resistant Display Type IPS LCD, 90Hz, 550 nits (HBM) Size 6. 79 inches, 109. 5 cm2 (~85. 1% screen to body ratio) Resolution 1080 x 2460 pixels (~396 ppi density)