DD Uni Bond D Medit Thermal expansion coefficient 25-600 °C

Thermal expansion coefficient 25-600 °C

DD cubeY ® HL is suitable for the production of highly aesthetic restorations with large spans

Our favorite for the front teeth area

crowns and bridges

DD Uni Bond D Medit Thermal expansion coefficient 25-600 °CThe bonding agent for the tooth structure DD Uni Bond D is a dual curing self etch bond reinforced with nanoparticles for creating a permanent, gap free bond between tooth structure and DD Solid Link. DD Uni Bond D consists of 2 components. Advantages: Chemical hardening for light inaccessible areas Achieves the same adhesive properties as total etch preparations without separate etching of the tooth substance Moisture tolerant Permanently edge tight